Form：360doc 2017/12/25Browse：4160

DRAM market conditions will be different next year, DRAM market will continue to be tight, NAND Flash market will be in the first half of next year into oversupply.

Form：MediaTek.Inc 2017/12/19Browse：4710

MediaTek has been aggressively pursuing the 5G market. Together with ITRI, it has developed LWA (LTE / Wi-Fi Link Aggregation) technology to improve network transmission bandwidth and 38/39 GHz millimeter-wave high-band access technology , And MUST (Multi-User Superposition Transmission) technology that supports the transmission capacity of small base stations. It has made headway and business opportunities for Taiwan to enter the global 5G communications market and is moving towards the goal of 5G network commercialization by 2020.

Form：Murata 2017/12/19Browse：4413

Murata Manufacturing Co., Ltd. (hereinafter referred to as "Murata") has worked for many years in the field of communication modules. A few years ago the rapid development of the Internet era, Murata 2.4G Hz communication module has been playing a decisive role in all walks of life, from the phone's Wi-Fi module to the Bluetooth module used in the car, and then to the smart home Involved ZigBee module, Murata rely on a wide range of products and excellent reputation of quality again and again won the trust of customers. By 2017, at a critical period of explosive growth of this Internet of Things technology, Murata is also closely following the tide of the market and has taken the lead in the field of LPWAN (Low Power Wide Area Networks).

Form：NVIDIA 2017/9/22Browse：6126

NVIDIA today announced the release of the 17.7 Edition PGI 2017 Compiler and Tools to help high-performance computing systems developers develop higher-performing software for systems equipped with multi-core CPUs and heterogeneous GPU accelerators, while dramatically simplifying program design Process.

Form：Tektronix 2017/9/22Browse：5358

Tektronix, the world's leading supplier of measurement solutions, today introduced the new DPO7OE1, a calibrated optical probe and analysis software for use with real-time oscilloscopes, and is an optical reference for compatibility with 28-GBaud PAM4 applications Receiver (ORR), and can support IEEE / OIF-CEI standard specific measurement. The new solution complements Tektronix's sampling oscilloscope optical PAM4 analysis tool, providing the design team with an effective test solution for all stages of the optical transmitter workflow.

Form：Western Digital (WD) 2017/9/19Browse：4746

SAN FRANCISCO (MarketWatch) - Western Digital Inc. (NYSE: TXN) today announced the launch of the 400GB Flash Digital High-Speed Mobile MicroSDXC UHS-I card, a microSD card for high-capacity mobile devices. After two years ago, after launching the 200GB Red Dodge high-speed mobile microSDXC card, Western Digital Inc. doubled storage capacity to double the same volume of SD card to 400GB.

Form：Tektronix 2017/9/8Browse：4254

How to ensure the availability and quality of instant and archival content will be a key challenge for video content distributors with variable bit rate (ABR) and network delivery (OTT) delivery models. Tektronix is the industry leader in video test and monitoring solutions, today introduced a full range of on-demand video (VOD) and instant OTT monitoring solutions, a leading video test, monitoring and diagnostic solution innovator, Industry and other video content distributors use cloud, virtual or physical networking to ensure high quality content.

Form：FLIRSystems,Inc. 2017/9/6Browse：3966

Recently, FLIR, a global leader in infrared thermal imaging, has introduced a new intelligent I / O solution specifically designed for FLIR infrared cameras to enable FLIR customers to integrate FLIR AX8, A310 and FCR thermal imagers with MIO to create a complete robust system for condition monitoring, early fire detection and process monitoring.

Form：Keyssa 2017/9/6Browse：3817

Keyssa, a leader in contactless connectivity solutions, today introduced the KSS104M, a new generation of component connector products, in an ultra-compact 3 x 3mm package with improved electrical and mechanical tolerances for easier design, significantly reduced power consumption and support High-speed communication protocol for industry standards. Keyssa also publishes KSS104M-CW (Connected World), which is a ready-to-use non-contact connection module that includes all the electromagnetic and mechanical requirements of critical systems, enabling the KSS104M to be built into mobile devices and other system products.

Form：National Instruments 2017/9/6Browse：3632

NI (National Instruments, National Instruments, Inc.) as a commitment to engineers and scientists to provide solutions to meet the world's most serious engineering challenges of the supplier, today announced the launch of a series of PCI Express Gen 3 connected high-performance PXI Remote control and bus expansion module. PCI Express Gen 3 technology provides higher bandwidth, which brings the gospel to applications such as 5G mobile research, RF recording and playback, and high-channel data acquisition, which require significant amounts of data.